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| Issue Type | XXXX |
|---|---|
| Country | Japan |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2027-05-28 |
| Par Value | 100000000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 200000.00 |
| Coupon | 0.31 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 200000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This AGC Inc corporate bond has a 0.31% fixed rate coupon paid on a semi-annual basis. It was issued on May 29, 2017 with an issue size of 200000.00 million JPY and matures on May 28, 2027 with a last coupon date of November 29, 2026. |
AGC Inc, founded in 1984 and headquartered in Chicago, Illinois, is a leading provider of cutting-edge technology solutions aimed at enhancing operational efficiency for businesses across various sectors. The company specializes in software development, data analytics, and cloud services, positioning itself as a key player in the rapidly evolving tech landscape.