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| Issue Type | XXXX |
|---|---|
| Country | Japan |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2030-12-13 |
| Par Value | 100000000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 30000.00 |
| Coupon | 0.865 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 30000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Hitachi Ltd. corporate bond has a 0.86% fixed rate coupon paid on a semi-annual basis. It was issued on December 14, 2023 with an issue size of 30000.00 million JPY and matures on December 13, 2030 with a last coupon date of June 14, 2030. |
Hitachi Ltd., founded in 1910 and headquartered in Tokyo, Japan, is a multinational conglomerate focused on social innovation, combining advanced technologies with diverse expertise. The company offers a wide range of products and services, including IT services, digital solutions, infrastructure systems, and advanced manufacturing technologies, positioning itself as a leader in various sectors.