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| Issue Type | XXXX |
|---|---|
| Country | Japan |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2028-06-15 |
| Par Value | 100000000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 20000.00 |
| Coupon | 0.355 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 20000 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Topcon Corporation corporate bond has a 0.35% fixed rate coupon paid on a semi-annual basis. It was issued on June 15, 2023 with an issue size of 20000.00 million JPY and matures on June 15, 2028 with a last coupon date of December 15, 2027. |
Topcon Corporation, founded in 1932 and headquartered in Tokyo, Japan, specializes in precision measurement and alignment technology. The company provides advanced solutions for various sectors, including construction, survey, agriculture, and healthcare, with notable products such as optical instruments and positioning systems.