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| Issue Type | XXXX |
|---|---|
| Country | United States |
| Industry | XXXX |
| Region | XXXX |
| Maturity Date | 2028-01-15 |
| Par Value | 1000 |
| Callable | XXXX |
| Next Call Date | XXXX |
| Call Type | XXXX |
| Call Price (%) | XXXX |
| Series | XXXX |
| Class | XXXX |
| Maturity Structure | XXXX |
| Amount Outstanding (mil) | 300.00 |
| Coupon | 6.75 |
|---|---|
| Coupon Type | XXXX |
| Coupon Frequency | XXXX |
| First Coupon Date | XXXX |
| Last Coupon Date | XXXX |
| Sinking Fund | XXXX |
|---|---|
| Security | XXXX |
| Subordination | XXXX |
| Debt Type | XXXX |
| Issue Date | XXXX |
|---|---|
| Dated Date | XXXX |
| Issue Size (mil) | 300 |
| Min. Piece | XXXX |
| Min. Increment | XXXX |
This Howmet Aerospace Inc corporate bond has a 6.75% fixed rate coupon paid on a semi-annual basis. It was issued on January 27, 1998 with an issue size of 300.00 million USD and matures on January 15, 2028 with a last coupon date of July 15, 2027. |
Howmet Aerospace Inc, founded in 2016 and headquartered in Pittsburgh, Pennsylvania, operates within the aerospace and engineering sector with a focus on advanced manufacturing solutions. The company is recognized for its cutting-edge aerospace components and technologies, including high-performance metal and aluminum products essential for commercial and defense aircraft.