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Issue Type | XXXX |
---|---|
Country | Germany |
Industry | XXXX |
Region | XXXX |
Maturity Date | 2029-01-23 |
Par Value | 100000 |
Callable | XXXX |
Next Call Date | XXXX |
Call Type | XXXX |
Call Price (%) | XXXX |
Series | XXXX |
Class | XXXX |
Maturity Structure | XXXX |
Amount Outstanding (mil) | 345.20 |
Coupon | 1.5 |
---|---|
Coupon Type | XXXX |
Coupon Frequency | XXXX |
First Coupon Date | XXXX |
Last Coupon Date | XXXX |
Sinking Fund | XXXX |
---|---|
Security | XXXX |
Subordination | XXXX |
Debt Type | XXXX |
Issue Date | XXXX |
---|---|
Dated Date | XXXX |
Issue Size (mil) | 345.2 |
Min. Piece | XXXX |
Min. Increment | XXXX |
This GlobalWafers GmbH corporate bond has a 1.50% fixed rate coupon paid on a annual basis. It was issued on January 23, 2024 with an issue size of 345.20 million EUR and matures on January 23, 2029 with a last coupon date of January 23, 2028. |
GlobalWafers GmbH, founded in Germany, is a key player in the semiconductor industry, focusing on the production and supply of silicon wafers used in various electronic applications. The company specializes in delivering high-quality wafers for both standard and custom semiconductor solutions, catering to technology firms worldwide.