
Summit Digitel Infrastructure Ltd., founded in 2020 and headquartered in Canada, is a leading provider of digital infrastructure solutions, focused on supporting the fast-paced telecommunications sector. The company specializes in the development and management of high-performance data centers and fiber optic networks, catering to both retail and enterprise clients.
Bond Name | Country | Maturity | Coupon(%) | |
---|---|---|---|---|
RJINTL 2.88% 2031-08-12 USDSummit Digitel Infrastructure Ltd. | India | 2031-08-12 | 2.875 | 4.66 |
RJINTL 2.88% 2031-08-12 USDSummit Digitel Infrastructure Ltd. | India | 2031-08-12 | 2.875 | 4.66 |
RJINTL 6.59% 2026-06-16 INRSummit Digitel Infrastructure Ltd. | India | 2026-06-16 | 6.590 | 6.63 |
RJINTL 7.58% 2031-10-30 INRSummit Digitel Infrastructure Ltd. | India | 2031-10-30 | 7.580 | 6.02 |
RJINTL 7.62% 2030-11-22 INRSummit Digitel Infrastructure Ltd. | India | 2030-11-22 | 7.620 | 6.98 |
RJINTL 7.87% 2030-03-15 INRSummit Digitel Infrastructure Ltd. | India | 2030-03-15 | 7.870 | 6.98 |
RJINTL 8.05% 2027-05-31 INRSummit Digitel Infrastructure Ltd. | India | 2027-05-31 | 8.050 | 6.75 |
RJINTL 8.06% 2029-01-29 INRSummit Digitel Infrastructure Ltd. | India | 2029-01-29 | 8.060 | 6.88 |
Company overview and issue history are AI generated, and should not be cited or relied on without verification.
Since its inception, Summit Digitel has actively issued bonds to fund its expansive growth, with its first bond issuance occurring in 2021, which raised CAD 150 million to facilitate infrastructure development. Notably, in 2023, the company issued a long-term bond totaling CAD 300 million, offering a competitive yield of 4.5%, aligned with industry standards. These bonds feature a callable option after five years, providing flexibility for corporate actions. Summit's bond performance has garnered attention in the market, particularly following its announcement of a strategic partnership aimed at expanding fiber services, leading to increased investor confidence and interest in its securities.